Interface-facilitated deformation twinning in copper within submicron Ag–Cu multilayered composites

TitleInterface-facilitated deformation twinning in copper within submicron Ag–Cu multilayered composites
Publication TypeJournal Article
Year of Publication2011
AuthorsJ. Wang, I.J. Beyerlein, N.A. Mara, and D. Bhattacharyya
JournalScripta Materialia
Volume64
Pagination1083–1086
DOI10.1016/j.scriptamat.2011.02.025